CPC Subgroup
H05K 1/02 Details
Full Title
Printed circuits > Details
15 direct subcodes
Child Classifications
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- H05K 1/03 Use of materials for the substrate
- H05K 1/09 Use of materials for the metallic pattern
- H05K 1/11 Printed elements for providing electric connections to or between printed circuits
- H05K 1/14 Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907