H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Description
Covers the design, manufacture, and assembly of printed circuit boards (PCBs), including circuit patterns, substrate materials, and interconnection technologies. Encompasses mechanical casings, enclosures, and structural components that house electrical apparatus, as well as manufacturing processes for assembling discrete electrical and electronic components onto circuit boards. Addresses thermal management, insulation, shielding, and interconnection methods for electronic equipment.
Filing statistics
CPC subclass H05K recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).
Source: EPO PATSTAT, worldwide filings
10 direct subcodes
Child Classifications
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- H05K 1/00 Printed circuits
- H05K 10/00 Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit
- H05K 11/00 Combinations of a radio or television receiver with apparatus having a different main function
- H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K 2201/00 Indexing scheme relating to printed circuits covered by H05K1/00
- H05K 2203/00 Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K 3/00 Apparatus or processes for manufacturing printed circuits
- H05K 5/00 Casings, cabinets or drawers for electric apparatus
- H05K 7/00 Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K5/00)
- H05K 9/00 Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00)
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907