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CPC Subclass Not Allocatable
H05K

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

Description

Covers the design, manufacture, and assembly of printed circuit boards (PCBs), including circuit patterns, substrate materials, and interconnection technologies. Encompasses mechanical casings, enclosures, and structural components that house electrical apparatus, as well as manufacturing processes for assembling discrete electrical and electronic components onto circuit boards. Addresses thermal management, insulation, shielding, and interconnection methods for electronic equipment.

10 direct subcodes

Child Classifications

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  • H05K 10/00 Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907