CPC Subgroup
H10P 50/20 Dry etching; Plasma etching; Reactive-ion etching
Full Title
Etching of wafers, substrates or parts of devices > Dry etching; Plasma etching; Reactive-ion etching
3 direct subcodes
Child Classifications
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- H10P 50/24 of semiconductor materials
- H10P 50/26 of conductive or resistive materials
- H10P 50/28 of insulating materials