CPC Subgroup
H10P 52/40 Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
Full Title
Grinding, lapping or polishing of wafers, substrates or parts of devices > Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
2 direct subcodes
Child Classifications
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