CPC Main Group
H10P 52/00 Grinding, lapping or polishing of wafers, substrates or parts of devices
2 direct subcodes
Child Classifications
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- H10P 52/20 Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
- H10P 52/40 Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)