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Patent Classification Explorer PCE

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Search for IPC and CPC classification codes or keywords

H
H10
H10P
H10P 56/00

CPC Main Group

H10P 56/00

Debonding of wafers, substrates or parts of devices

CPC H10P 56/00

IPC Equivalent: H10P 56/00

H10P 54/00 H10P 58/00

Data: WIPO (IPC), EPO/USPTO (CPC) — CC BY 4.0

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