Cutting or separating of wafers, substrates or parts of devices

Child Classifications

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• H10P 54/20 by laser cutting
• H10P 54/30 by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
• H10P 54/40 by sawing, e.g. using revolving or reciprocating blades
• H10P 54/50 by scoring, breaking or cleaving
• H10P 54/90 Auxiliary processes or arrangements