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CPC Subgroup
H10W 76/47

Solid or gel fillings

Full Title

Containers; Fillings or auxiliary members therefor; Seals > Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) > Fillings > Solid or gel fillings

Filing statistics

The most active applicants in class H10 are SAMSUNG DISPLAY (38,446 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (30,922 applications) and SAMSUNG ELECTRONICS COMPANY (30,059 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 38,446
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
  3. SAMSUNG ELECTRONICS COMPANY KR 30,059
  4. BOE TECHNOLOGY GROUP COMPANY CN 20,304
  5. LG DISPLAY COMPANY KR 17,772
  6. BOE TECHNOLOGY GROUP COMPANY 15,621
  7. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
  8. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
  9. SAMSUNG DISPLAY 11,316
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697