CPC Subgroup
H10W 90/20 Configurations of stacked chips
Full Title
Package configurations > Configurations of stacked chips
Filing statistics
The most active applicants in class H10 are SAMSUNG DISPLAY (38,446 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (30,922 applications) and SAMSUNG ELECTRONICS COMPANY (30,059 applications).
Source: EPO PATSTAT, worldwide filings
12 direct subcodes
Child Classifications
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- H10W 90/22 the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/24 at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
- H10W 90/26 the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape
- H10W 90/28 the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697