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DIFF Subgroup
B23D 67/12

Hand-held or hand-operated filing or rasping devices (hand files or rasps B23D71/04)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Hand-held or hand-operated filing or rasping devices

CPC: Hand-held or hand-operated filing or rasping devices (hand files or rasps B23D71/04)

Full Title

Full titles differ between systems:

IPC:

Filing or rasping machines or devices > Hand-held or hand-operated filing or rasping devices

CPC:

Filing or rasping machines or devices (securing arrangements for files or rasps B23D71/00) > Hand-held or hand-operated filing or rasping devices (hand files or rasps B23D71/04)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,407
  2. FANUC JP 3,120
  3. DISCO ABRASIVE SYSTEM 2,777
  4. HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
  5. ROBERT BOSCH DE 2,468
  6. FANUC 2,273
  7. DISCO CORPORATION JP 2,267
  8. GE (GENERAL ELECTRIC COMPANY) US 1,611
  9. CHINESE ACADEMY OF SCIENCES 1,534
  10. ISCAR IL 1,499

Top Applicants (CPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,642
  2. DISCO CORPORATION JP 3,316
  3. FANUC JP 3,111
  4. ROBERT BOSCH DE 2,711
  5. FANUC 2,163
  6. GE (GENERAL ELECTRIC COMPANY) US 2,113
  7. ISCAR IL 1,516
  8. SIEMENS DE 1,459
  9. LINCOLN GLOBAL US 1,433
  10. KOBE STEEL JP 1,423