DIFF Subgroup
B23K 26/20 Bonding (soldering by means of radiant energy B23K1/005)
Introduced: January 2000
Title
Titles differ between systems:
IPC: Bonding
CPC: Bonding (soldering by means of radiant energy B23K1/005)
Full Title
Full titles differ between systems:
IPC:
Working by laser beam, e.g. welding, cutting or boring > Bonding
CPC:
Working by laser beam, e.g. welding, cutting or boring > Bonding (soldering by means of radiant energy B23K1/005)
Of 3 combined children, 2 exist in both systems.
1 codes are CPC-only extensions.
IPC defines codes here since 2000.
Child Classifications
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- B23K 26/32 taking account of the properties of the material involved since 2000 IPC+CPC Available in IPC and CPC