DIFF Subgroup
B23K 26/211 with interposition of special material to facilitate connection of the parts
Introduced: January 2014
Full Title
Full titles differ between systems:
IPC:
Working by laser beam, e.g. welding, cutting or boring > Bonding > by welding > with interposition of special material to facilitate connection of the parts
CPC:
Working by laser beam, e.g. welding, cutting or boring > Bonding (soldering by means of radiant energy B23K1/005) > by welding > with interposition of special material to facilitate connection of the parts
No child classifications to compare. This is a leaf node in both IPC and CPC.