DIFF Subgroup Additional Only
B81C 2203/037 Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
Full Title
Forming microstructural systems > Bonding two components > Thermal bonding > Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
Top Applicants
Top Applicants (IPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 2,338
- INFINEON TECHNOLOGIES DE 702
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
- CHINESE ACADEMY OF SCIENCES 508
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
- SEIKO EPSON CORPORATION 484
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
- INVENSENSE US 378
- STMICROELECTRONICS IT 365
- FRAUNHOFER DE 337
Top Applicants (CPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297