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DIFF Class Not Allocatable
B81

MICROSTRUCTURAL TECHNOLOGY

Description

B81 covers the design, manufacture, and manipulation of structures and devices at microscopic and submicroscopic scales, typically involving dimensions in the micrometer to nanometer range. This includes micromechanical systems (MEMS), microelectromechanical systems (NEMS), and related fabrication techniques such as lithography, etching, and deposition processes used to create miniaturized mechanical, optical, and electronic components. The classification encompasses both the production methods and the resulting microstructures used in sensors, actuators, and other functional micro-scale devices across diverse applications.

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

2 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2000.

Child Classifications

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Top Applicants

Top Applicants (IPC)

2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 2,338
  2. INFINEON TECHNOLOGIES DE 702
  3. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
  4. CHINESE ACADEMY OF SCIENCES 508
  5. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
  6. SEIKO EPSON CORPORATION 484
  7. HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
  8. INVENSENSE US 378
  9. STMICROELECTRONICS IT 365
  10. FRAUNHOFER DE 337

Top Applicants (CPC)

2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297