DIFF Subgroup
C23F 1/10 Etching compositions (C23F1/44 takes precedence)
Introduced: January 1985
Title
Titles differ between systems:
IPC: Etching compositions
CPC: Etching compositions (C23F1/44 takes precedence)
Full Title
Full titles differ between systems:
IPC:
Etching metallic material by chemical means > Etching compositions
CPC:
Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence)
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
IPC defines codes here since 1985.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 8,096
- TOKYO ELECTRON JP 3,985
- CHINESE ACADEMY OF SCIENCES 2,842
- LAM RESEARCH CORPORATION US 2,654
- TOKYO ELECTRON 2,540
- NIPPON STEEL CORPORATION JP 2,465
- JFE STEEL JP 2,368
- ASM IP HOLDING NL 2,092
- APPLIED MATERIALS 1,877
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782
Top Applicants (CPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110