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DIFF Main Group
C23F 4/00

Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

Introduced: January 1985

Title

Titles differ between systems:

IPC: Processes for removing metallic material from surfaces, not provided for in group or

CPC: Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

Full Title

Full titles differ between systems:

IPC:

Processes for removing metallic material from surfaces, not provided for in group or

CPC:

Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

IPC defines codes here since 1985.

Child Classifications

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  • C23F 4/02 by evaporation since 1985 IPC+CPC Available in IPC and CPC
  • C23F 4/04 by physical dissolution since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 8,096
  2. TOKYO ELECTRON JP 3,985
  3. CHINESE ACADEMY OF SCIENCES 2,842
  4. LAM RESEARCH CORPORATION US 2,654
  5. TOKYO ELECTRON 2,540
  6. NIPPON STEEL CORPORATION JP 2,465
  7. JFE STEEL JP 2,368
  8. ASM IP HOLDING NL 2,092
  9. APPLIED MATERIALS 1,877
  10. POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782

Top Applicants (CPC)

Class C23,2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110