DIFF Subgroup
C23F 4/04 by physical dissolution
Introduced: January 1985
Full Title
Full titles differ between systems:
IPC:
Processes for removing metallic material from surfaces, not provided for in group or > by physical dissolution
CPC:
Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 > by physical dissolution
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 8,096
- TOKYO ELECTRON JP 3,985
- CHINESE ACADEMY OF SCIENCES 2,842
- LAM RESEARCH CORPORATION US 2,654
- TOKYO ELECTRON 2,540
- NIPPON STEEL CORPORATION JP 2,465
- JFE STEEL JP 2,368
- ASM IP HOLDING NL 2,092
- APPLIED MATERIALS 1,877
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782
Top Applicants (CPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110