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DIFF Subgroup
G01R 31/70

Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)

Introduced: January 2020

Title

Titles differ between systems:

IPC: Testing of connections between components and printed circuit boards

CPC: Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere > Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections > Testing of connections, e.g. of plugs or non-disconnectable joints > Testing of connections between components and printed circuit boards

CPC:

Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ( testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture ) > Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections (testing of sparking plugs H01T13/58) > Testing of connections, e.g. of plugs or non-disconnectable joints (testing for incorrect line connections G01R31/55) > Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 2020.

Child Classifications

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  • G01R 31/71 Testing of solder joints since 2020 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 41,447
  2. CHINESE ACADEMY OF SCIENCES 32,952
  3. ROBERT BOSCH DE 16,470
  4. SAMSUNG ELECTRONICS COMPANY KR 10,052
  5. SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
  6. ZHEJIANG UNIVERSITY 9,529
  7. GUANGDONG POWER GRID CORPORATION 8,615
  8. TSINGHUA UNIVERSITY 7,805
  9. HALLIBURTON ENERGY SERVICES GROUP US 7,796
  10. QUALCOMM US 7,171

Top Applicants (CPC)

Class G01,2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382