G01R 31/70 Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)
Full Title
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ( testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture ) > Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections (testing of sparking plugs H01T13/58) > Testing of connections, e.g. of plugs or non-disconnectable joints (testing for incorrect line connections G01R31/55) > Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)
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Child Classifications
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- G01R 31/71 Testing of solder joints
Top Applicants
Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT
- CHINESE ACADEMY OF SCIENCES 21,460
- ROBERT BOSCH DE 17,801
- SGCC(STATE GRID CORPORATION OF CHINA) 17,347
- SAMSUNG ELECTRONICS COMPANY KR 13,192
- QUALCOMM US 9,900
- HALLIBURTON ENERGY SERVICES GROUP US 9,742
- PHILIPS ELECTRONICS NL 7,249
- MITSUBISHI ELECTRIC CORPORATION JP 6,503
- ZHEJIANG UNIVERSITY 6,414
- DENSO CORPORATION JP 6,382