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CPC Subgroup
G01R 31/70

Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)

Full Title

Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ( testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture ) > Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections (testing of sparking plugs H01T13/58) > Testing of connections, e.g. of plugs or non-disconnectable joints (testing for incorrect line connections G01R31/55) > Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)

1 direct subcode

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Top Applicants

Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINESE ACADEMY OF SCIENCES 21,460
  2. ROBERT BOSCH DE 17,801
  3. SGCC(STATE GRID CORPORATION OF CHINA) 17,347
  4. SAMSUNG ELECTRONICS COMPANY KR 13,192
  5. QUALCOMM US 9,900
  6. HALLIBURTON ENERGY SERVICES GROUP US 9,742
  7. PHILIPS ELECTRONICS NL 7,249
  8. MITSUBISHI ELECTRIC CORPORATION JP 6,503
  9. ZHEJIANG UNIVERSITY 6,414
  10. DENSO CORPORATION JP 6,382