G11B 11/00 Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
Introduced: September 1968
Title
Titles differ between systems:
IPC: Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group; Record carriers therefor
CPC: Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
Full Title
Full titles differ between systems:
Recording on, or reproducing from, the same record carrier wherein for these two operations the methods or means are covered by different main groups of groups or by different subgroups of group; Record carriers therefor
Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
Of 7 combined children, 6 exist in both systems.
1 codes are CPC-only extensions.
2 shared codes have differing titles between IPC and CPC.
Child Classifications
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- G11B 11/03 using recording by deforming with non-mechanical means, e.g. laser, beam of particles since 1985 IPC+CPC Available in IPC and CPC
- G11B 11/08 using recording by electric charge or by variation of electric resistance or capacitance IPC+CPC Available in IPC and CPC
- G11B 11/12 using recording by optical means (G11B11/03 takes precedence ) IPC+CPC Available in IPC and CPC
- G11B 11/16 using recording by mechanical cutting, deforming or pressing IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961