DIFF Main Group
G11B 33/00 Constructional parts, details or accessories not provided for in the other groups of this subclass
Introduced: January 1985
Of 5 combined children, 4 exist in both systems.
1 codes are CPC-only extensions.
IPC defines codes here since 1985.
Child Classifications
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- G11B 33/02 Cabinets; Cases; Stands; Disposition of apparatus therein or thereon since 1985 +2 CPC IPC+CPC Available in IPC and CPC
- G11B 33/10 Indicating arrangements; Warning arrangements since 1985 IPC+CPC Available in IPC and CPC
- G11B 33/12 Disposition of constructional parts in the apparatus, e.g. of power supply, of modules since 1985 +2 CPC IPC+CPC Available in IPC and CPC
- G11B 33/14 Reducing influence of physical parameters, e.g. temperature change, moisture, dust since 1985 +5 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961