Base layers

Introduced: January 2000

Full Title

Full titles differ between systems:

IPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor > Record carriers characterised by the selection of the material > Base layers

CPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor (G11B11/00 take precedence) > Record carriers characterised by the selection of the material > Base layers

Of 6 combined children, 2 exist in both systems.

3 codes are CPC-only extensions, 1 exist only in IPC.

IPC defines codes here since 2000.

Child Classifications

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G11B 5/733 characterised by the addition of non-magnetic particles since 2000 +1 CPC IPC+CPC Available in IPC and CPC
G11B 5/735 characterised by the back layer since 2000 +2 CPC IPC+CPC Available in IPC and CPC
G11B 5/736 +6 CPC CPC only CPC only
G11B 5/7368 +6 CPC CPC only CPC only
G11B 5/738 characterised by the intermediate layer since 2000 IPC only IPC only
G11B 5/739 +2 CPC CPC only CPC only

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 10,574
SK HYNIX KR 9,138
SAMSUNG ELECTRONICS COMPANY KR 9,004
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
INTEL CORPORATION US 2,952
SANDISK TECHNOLOGIES US 2,905
WESTERN DIGITAL TECHNOLOGIES US 2,630
TOSHIBA CORPORATION JP 2,593
SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 12,397
SAMSUNG ELECTRONICS COMPANY KR 12,238
SK HYNIX KR 11,371
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
INTEL CORPORATION US 3,874
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
SANDISK TECHNOLOGIES US 3,151
SK HYNIX 3,143
SAMSUNG ELECTRONICS COMPANY 3,073
WESTERN DIGITAL TECHNOLOGIES US 2,961