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PCE
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DIFF Subgroup
G11B 5/84

Processes or apparatus specially adapted for manufacturing record carriers

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor > Processes or apparatus specially adapted for manufacturing record carriers

CPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor (G11B11/00 take precedence) > Processes or apparatus specially adapted for manufacturing record carriers

Additional Content IPC

Processes involving a single technical art, in general, and for which provision exists elsewhere, see the relevant places, e.g. , , for painting, shaping, evaporation coating and galvanizing in general , ,

Of 11 combined children, 7 exist in both systems.

4 codes are CPC-only extensions.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1985.

Child Classifications

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  • G11B 5/8404 CPC only CPC only
  • G11B 5/8408 CPC only CPC only
  • G11B 5/8412 CPC only CPC only
  • G11B 5/8416 CPC only CPC only
  • G11B 5/848 Coating a support with a magnetic layer by extrusion since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/85 Coating a support with a magnetic layer by vapour deposition since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/851 Coating a support with a magnetic layer by sputtering since 2000 IPC+CPC Available in IPC and CPC
  • G11B 5/852 Orientation in a magnetic field (G11B5/845 takes precedence) since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/855 Coating only part of a support with a magnetic layer since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/858 Producing a magnetic layer by electro-plating or electroless plating since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961