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PCE
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DIFF Subgroup
G11B 7/244

comprising organic materials only

Introduced: January 2006

Full Title

Full titles differ between systems:

IPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Record carriers characterised by shape, structure or physical properties, or by the selection of the material > Record carriers characterised by the selection of the material > of recording layers > comprising organic materials only

CPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Record carriers characterised by shape, structure or physical properties, or by the selection of the material (characterised by the arrangement of information on the carrier G11B7/007) > characterised by the selection of the material > of recording layers > comprising organic materials only

Of 5 combined children, 4 exist in both systems.

1 codes are CPC-only extensions.

Note: 1 CPC extensions are marked as secondary classification only.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • G11B 2007/2445 2nd only CPC only CPC only
  • G11B 7/245 containing a polymeric component since 2006 IPC+CPC Available in IPC and CPC
  • G11B 7/25 containing liquid crystals since 2006 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961