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DIFF Subgroup
G11C 29/04

Detection or location of defective memory elements

Introduced: January 2006

Full Title

Full titles differ between systems:

IPC:

Checking stores for correct operation; Testing stores during standby or offline operation > Detection or location of defective memory elements

CPC:

Checking stores for correct operation ; Testing stores during standby or offline operation > Detection or location of defective memory elements

CPC subdivides this area 3x more granularly than IPC with 6 additional codes.

6 codes are CPC-only extensions.

Note: 6 CPC extensions are marked as secondary classification only.

IPC defines codes here since 2006.

Child Classifications

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  • G11C 2029/0401 2nd only CPC only CPC only
  • G11C 2029/0403 2nd only CPC only CPC only
  • G11C 2029/0405 2nd only CPC only CPC only
  • G11C 2029/0407 2nd only CPC only CPC only
  • G11C 2029/0409 2nd only CPC only CPC only
  • G11C 2029/0411 2nd only CPC only CPC only
  • G11C 29/06 Acceleration testing since 2006 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961