DIFF Subgroup
G11C 29/04 Detection or location of defective memory elements
Introduced: January 2006
Full Title
Full titles differ between systems:
IPC:
Checking stores for correct operation; Testing stores during standby or offline operation > Detection or location of defective memory elements
CPC:
Checking stores for correct operation ; Testing stores during standby or offline operation > Detection or location of defective memory elements
CPC subdivides this area 3x more granularly than IPC with 6 additional codes.
6 codes are CPC-only extensions.
Note: 6 CPC extensions are marked as secondary classification only.
IPC defines codes here since 2006.
Child Classifications
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- G11C 29/08 Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing since 2006 IPC+CPC Available in IPC and CPC
- G11C 29/50 Marginal testing, e.g. race, voltage or current testing since 2006 +7 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961