Supports for storage elements ; Mounting or fixing of storage elements on such supports

Introduced: September 1968

Title

Titles differ between systems:

IPC: Supports for storage elements; Mounting or fixing of storage elements on such supports

CPC: Supports for storage elements ; Mounting or fixing of storage elements on such supports

Full Title

Full titles differ between systems:

IPC:

Details of stores covered by group > Disposition of storage elements, e.g. in the form of a matrix array > Supports for storage elements; Mounting or fixing of storage elements on such supports

CPC:

Details of stores covered by group G11C11/00 > Disposition of storage elements, e.g. in the form of a matrix array > Supports for storage elements ; Mounting or fixing of storage elements on such supports

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 1974.

Child Classifications

Navigate with arrow keys, Enter to open

G11C 5/05 Supporting of cores in matrix since 1974 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 10,574
SK HYNIX KR 9,138
SAMSUNG ELECTRONICS COMPANY KR 9,004
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
INTEL CORPORATION US 2,952
SANDISK TECHNOLOGIES US 2,905
WESTERN DIGITAL TECHNOLOGIES US 2,630
TOSHIBA CORPORATION JP 2,593
SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 12,397
SAMSUNG ELECTRONICS COMPANY KR 12,238
SK HYNIX KR 11,371
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
INTEL CORPORATION US 3,874
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
SANDISK TECHNOLOGIES US 3,151
SK HYNIX 3,143
SAMSUNG ELECTRONICS COMPANY 3,073
WESTERN DIGITAL TECHNOLOGIES US 2,961