DIFF Main Group
G11C 5/00 Details of stores covered by group G11C11/00
Introduced: September 1968
Title
Titles differ between systems:
IPC: Details of stores covered by group
CPC: Details of stores covered by group G11C11/00
Full Title
Full titles differ between systems:
IPC:
Details of stores covered by group
CPC:
Details of stores covered by group G11C11/00
Of 5 combined children, 4 exist in both systems.
1 codes are CPC-only extensions.
Child Classifications
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- G11C 5/02 Disposition of storage elements, e.g. in the form of a matrix array +1 CPC IPC+CPC Available in IPC and CPC
- G11C 5/06 Arrangements for interconnecting storage elements electrically, e.g. by wiring +2 CPC IPC+CPC Available in IPC and CPC
- G11C 5/12 Apparatus or processes for interconnecting storage elements, e.g. for threading magnetic cores IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961