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DIFF Subgroup
G11C 5/06

Arrangements for interconnecting storage elements electrically, e.g. by wiring

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Details of stores covered by group > Arrangements for interconnecting storage elements electrically, e.g. by wiring

CPC:

Details of stores covered by group G11C11/00 > Arrangements for interconnecting storage elements electrically, e.g. by wiring

Of 4 combined children, 2 exist in both systems.

2 codes are CPC-only extensions.

Child Classifications

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  • G11C 5/063 CPC only CPC only
  • G11C 5/066 CPC only CPC only
  • G11C 5/08 for interconnecting magnetic elements, e.g. toroidal cores IPC+CPC Available in IPC and CPC
  • G11C 5/10 for interconnecting capacitors IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961