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PCE
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DIFF Subgroup
H01B 1/20

Conductive material dispersed in non-conductive organic material

Introduced: January 1980

Full Title

Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors > Conductive material dispersed in non-conductive organic material

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1980.

Child Classifications

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  • H01B 1/22 the conductive material comprising metals or alloys since 1980 IPC+CPC Available in IPC and CPC
  • H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080