H01C 17/24 by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)
Introduced: July 1974
Title
Titles differ between systems:
IPC: by removing or adding resistive material
CPC: by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)
Full Title
Full titles differ between systems:
Apparatus or processes specially adapted for manufacturing resistors > adapted for trimming > by removing or adding resistive material
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for trimming > by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)
CPC subdivides this area 3x more granularly than IPC with 4 additional codes.
4 codes are CPC-only extensions.
IPC defines codes here since 1995.
Child Classifications
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- H01C 17/245 by mechanical means, e.g. sand-blasting, cutting or ultrasonic treatment since 1995 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080