by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)

Introduced: July 1974

Title

Titles differ between systems:

IPC: by removing or adding resistive material

CPC: by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)

Full Title

Full titles differ between systems:

IPC:

Apparatus or processes specially adapted for manufacturing resistors > adapted for trimming > by removing or adding resistive material

CPC:

Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for trimming > by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)

CPC subdivides this area 3x more granularly than IPC with 4 additional codes.

4 codes are CPC-only extensions.

IPC defines codes here since 1995.

Child Classifications

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H01C 17/2404 CPC only CPC only
H01C 17/2408 CPC only CPC only
H01C 17/2412 CPC only CPC only
H01C 17/2416 CPC only CPC only
H01C 17/242 by laser since 1995 IPC+CPC Available in IPC and CPC
H01C 17/245 by mechanical means, e.g. sand-blasting, cutting or ultrasonic treatment since 1995 IPC+CPC Available in IPC and CPC