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DIFF Subgroup
H01F 7/128

Encapsulating, encasing or sealing

Introduced: January 1995

Full Title

Full titles differ between systems:

IPC:

Magnets > Electromagnets; Actuators including electromagnets > with armatures > Encapsulating, encasing or sealing

CPC:

Magnets (superconducting magnets H01F6/00; for separation of solid materials or fluids B03C1/00; for bench or like work-holders B23B31/28, B23Q3/00; work-holding devices B25B11/00; lifting magnets B66C1/00; ; for electric meters G01R; for relays H01H; ; for dynamo-electric machines H02K) > Electromagnets; Actuators including electromagnets > with armatures > Encapsulating, encasing or sealing

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 1995.

Child Classifications

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  • H01F 7/129 of armatures since 1995 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080