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IPC Subgroup
H01F 7/128

Encapsulating, encasing or sealing

Introduced: January 1995

Last revised: January 2006

Full Title

Magnets > Electromagnets; Actuators including electromagnets > with armatures > Encapsulating, encasing or sealing

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634