H01H 85/02 Details
Introduced: September 1968
Full Title
Full titles differ between systems:
Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive > Details
Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive (switches actuated by melting of fusible material H01H37/76; disposition or arrangement of fuses on boards H02B1/18) > Details
Of 19 combined children, 14 exist in both systems.
5 codes are CPC-only extensions.
Note: 3 CPC extensions are marked as secondary classification only.
2 shared codes have differing titles between IPC and CPC.
Child Classifications
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- H01H 85/04 Fuses, i.e. expendable parts of the protective device, e.g. cartridges IPC+CPC Available in IPC and CPC
- H01H 85/20 Bases for supporting the fuse; Separate parts thereof +14 CPC IPC+CPC Available in IPC and CPC
- H01H 85/22 Intermediate or auxiliary parts for carrying, holding, or retaining fuse, co-operating with base or fixed holder, and removable therefrom for renewing the fuse IPC+CPC Available in IPC and CPC
- H01H 85/25 Safety arrangements preventing or inhibiting contact with live parts, including operation of isolation on removal of cover since 1990 IPC+CPC Available in IPC and CPC
- H01H 85/30 Means for indicating condition of fuse structurally associated with the fuse +1 CPC IPC+CPC Available in IPC and CPC
- H01H 85/38 Means for extinguishing or suppressing arc (by powder filling H01H85/18; by mechanical tension applied to fusible member H01H85/36) +5 CPC IPC+CPC Available in IPC and CPC
- H01H 85/43 Means for exhausting or absorbing gases liberated by fusing arc, or for ventilating excess pressure generated by heating since 1990 IPC+CPC Available in IPC and CPC
- H01H 85/46 Circuit arrangements not adapted to a particular application of the protective device +2 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080