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PCE
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DIFF Subgroup
H01H 85/38

Means for extinguishing or suppressing arc (by powder filling H01H85/18; by mechanical tension applied to fusible member H01H85/36)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Means for extinguishing or suppressing arc

CPC: Means for extinguishing or suppressing arc (by powder filling H01H85/18; by mechanical tension applied to fusible member H01H85/36)

Full Title

Full titles differ between systems:

IPC:

Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive > Details > Means for extinguishing or suppressing arc

CPC:

Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive (switches actuated by melting of fusible material H01H37/76; disposition or arrangement of fuses on boards H02B1/18) > Details > Means for extinguishing or suppressing arc (by powder filling H01H85/18; by mechanical tension applied to fusible member H01H85/36)

CPC subdivides this area 4x more granularly than IPC with 5 additional codes.

5 codes are CPC-only extensions.

Note: 5 CPC extensions are marked as secondary classification only.

2 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01H 2085/381 2nd only CPC only CPC only
  • H01H 2085/383 2nd only CPC only CPC only
  • H01H 2085/385 2nd only CPC only CPC only
  • H01H 2085/386 2nd only CPC only CPC only
  • H01H 2085/388 2nd only CPC only CPC only
  • H01H 85/40 using an arc-extinguishing liquid (characterised by the composition of the liquid H01H33/22) IPC+CPC Available in IPC and CPC
  • H01H 85/42 using an arc-extinguishing gas (characterised by the composition of the gas H01H33/22) IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080