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PCE
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DIFF Subgroup
H01J 5/22

Vacuum-tight joints between parts of vessel

Introduced: September 1968

Full Title

Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps > Seals between parts of vessels > Vacuum-tight joints between parts of vessel

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01J 5/24 between insulating parts of vessel IPC+CPC Available in IPC and CPC
  • H01J 5/26 between insulating and conductive parts of vessel IPC+CPC Available in IPC and CPC
  • H01J 5/28 between conductive parts of vessel IPC+CPC Available in IPC and CPC
  • H01J 5/30 using packing-material, e.g. sealing-liquid or elastic insert IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080