DIFF Subgroup
H01P 1/22 Attenuating devices (dissipative terminating devices H01P1/26)
Introduced: September 1968
Title
Titles differ between systems:
IPC: Attenuating devices
CPC: Attenuating devices (dissipative terminating devices H01P1/26)
Full Title
Full titles differ between systems:
IPC:
Auxiliary devices > Attenuating devices
CPC:
Auxiliary devices (coupling devices of the waveguide type H01P5/00) > Attenuating devices (dissipative terminating devices H01P1/26)
CPC subdivides this area 4x more granularly than IPC with 3 additional codes.
3 codes are CPC-only extensions.
IPC defines codes here since 1980.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080