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DIFF Subgroup
H01R 24/70

with additional earth or shield contacts

Introduced: January 2011

Full Title

Full titles differ between systems:

IPC:

Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure > with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall > with additional earth or shield contacts

CPC:

Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure (contact members H01R13/02; securing contact members in or to a base or case or insulating of contact members H01R13/40; bases or cases H01R13/46; means for supporting coupling part when not engaged H01R13/60; means for facilitating engagement or disengagement of coupling parts or for holding them in engagement H01R13/62; means for preventing, inhibiting or avoiding incorrect coupling H01R13/64) > with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall > with additional earth or shield contacts

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080