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DIFF Subclass Not Allocatable
H01R

ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Introduced: September 1968

Description

H01R encompasses electrical connection devices and systems that establish conductive pathways between electrical components. This subclass covers connectors, coupling devices, plugs, sockets, terminal assemblies, and current collectors used across diverse applications from consumer electronics to industrial equipment. It includes technologies for organizing and insulating multiple electrical conductors within a single connector body, as well as mechanisms for reliable and repeated connection/disconnection of circuits. Adjacent classes H01M (electrochemical devices) and H01G (capacitors) are excluded; H01R focuses specifically on mechanical and structural aspects of electrical connections rather than energy storage or conversion devices.

Of 25 combined children, 16 exist in both systems.

5 codes are CPC-only extensions, 4 exist only in IPC.

Note: 5 CPC extensions are marked as secondary classification only.

9 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01R 101/00 One pole since 2000 IPC only IPC only
  • H01R 103/00 Two poles since 2000 IPC only IPC only
  • H01R 105/00 Three poles since 2000 IPC only IPC only
  • H01R 107/00 Four or more poles since 2000 IPC only IPC only
  • H01R 2101/00 One pole 2nd only CPC only CPC only
  • H01R 2103/00 Two poles 2nd only CPC only CPC only
  • H01R 2105/00 Three poles 2nd only CPC only CPC only
  • H01R 2107/00 Four or more poles 2nd only CPC only CPC only
  • H01R 29/00 Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080