DIFF Main Group
H01R 31/00 Coupling parts supported only by co-operation with counterpart
Introduced: September 1968
Of 4 combined children, 3 exist in both systems.
1 codes are CPC-only extensions.
2 shared codes have differing titles between IPC and CPC.
Child Classifications
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- H01R 31/02 Intermediate parts for distributing energy to two or more circuits in parallel, e.g. splitter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/92) IPC+CPC Available in IPC and CPC
- H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) +1 CPC IPC+CPC Available in IPC and CPC
- H01R 31/08 Short-circuiting members for bridging contacts in a counterpart +1 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080