wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Arrangements for cooling or ventilating > wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle

CPC:

Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

Child Classifications

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H02K 9/16 wherein the cooling medium circulates through ducts or tubes within the casing IPC+CPC Available in IPC and CPC
H02K 9/18 wherein the external part of the closed circuit comprises a heat exchanger structurally associated with the machine casing IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

SGCC(STATE GRID CORPORATION OF CHINA) 54,496
MITSUBISHI ELECTRIC CORPORATION JP 10,495
TOYOTA MOTOR CORPORATION 9,464
GUANGDONG POWER GRID CORPORATION 9,339
ROBERT BOSCH DE 8,226
SIEMENS DE 8,218
DENSO CORPORATION 7,063
MITSUBISHI ELECTRIC CORPORATION 6,619
SAMSUNG ELECTRONICS COMPANY KR 5,826
GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

SGCC(STATE GRID CORPORATION OF CHINA) 24,515
MITSUBISHI ELECTRIC CORPORATION JP 11,346
SIEMENS DE 9,026
ROBERT BOSCH DE 9,005
SAMSUNG ELECTRONICS COMPANY KR 6,729
GUANGDONG POWER GRID CORPORATION 5,740
DENSO CORPORATION JP 5,077
LG ELECTRONICS KR 5,041
LG INNOTEK COMPANY KR 4,442
TOYOTA MOTOR CORPORATION 4,349