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PCE
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CPC Subgroup
H02K 9/14

wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle

Full Title

Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle

2 direct subcodes

Child Classifications

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  • H02K 9/16 wherein the cooling medium circulates through ducts or tubes within the casing
  • H02K 9/18 wherein the external part of the closed circuit comprises a heat exchanger structurally associated with the machine casing

Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349