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DIFF Subgroup
H02K 9/24

Protection against failure of cooling arrangements, e.g. due to loss of cooling medium or due to interruption of the circulation of cooling medium

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Arrangements for cooling or ventilating > Protection against failure of cooling arrangements, e.g. due to loss of cooling medium or due to interruption of the circulation of cooling medium

CPC:

Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > Protection against failure of cooling arrangements, e.g. due to loss of cooling medium or due to interruption of the circulation of cooling medium

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349