DIFF Subgroup
H02K 9/22 by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
Introduced: September 1968
Full Title
Full titles differ between systems:
IPC:
Arrangements for cooling or ventilating > by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
CPC:
Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
Of 3 combined children, 0 exist in both systems.
3 codes are CPC-only extensions.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 54,496
- MITSUBISHI ELECTRIC CORPORATION JP 10,495
- TOYOTA MOTOR CORPORATION 9,464
- GUANGDONG POWER GRID CORPORATION 9,339
- ROBERT BOSCH DE 8,226
- SIEMENS DE 8,218
- DENSO CORPORATION 7,063
- MITSUBISHI ELECTRIC CORPORATION 6,619
- SAMSUNG ELECTRONICS COMPANY KR 5,826
- GREE ELECTRIC APPLIANCES 5,094
Top Applicants (CPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349