Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements (wide-band amplifiers with inter-stage coupling networks incorporating these impedances H03F1/42)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements

CPC: Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements (wide-band amplifiers with inter-stage coupling networks incorporating these impedances H03F1/42)

Full Title

Full titles differ between systems:

IPC:

Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements > Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements

CPC:

Additional Content IPC

Wide-band amplifiers with inter-stage coupling networks incorporating these impedances

Of 6 combined children, 5 exist in both systems.

1 codes are CPC-only extensions.

Child Classifications

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H03F 1/083 +1 CPC CPC only CPC only
H03F 1/10 by use of amplifying elements with multiple electrode connections IPC+CPC Available in IPC and CPC
H03F 1/12 by use of attenuating means IPC+CPC Available in IPC and CPC
H03F 1/14 by use of neutralising means IPC+CPC Available in IPC and CPC
H03F 1/18 by use of distributed coupling IPC+CPC Available in IPC and CPC
H03F 1/22 by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively +2 CPC IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

QUALCOMM US 5,625
SAMSUNG ELECTRONICS COMPANY KR 5,496
MURATA MANUFACTURING COMPANY JP 5,478
HUAWEI TECHNOLOGIES COMPANY CN 3,383
INTEL CORPORATION US 3,091
TEXAS INSTRUMENTS US 3,070
MURATA MANUFACTURING COMPANY 2,722
SKYWORKS SOLUTIONS US 2,290
SEIKO EPSON CORPORATION 2,177
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 7,293
QUALCOMM US 7,085
MURATA MANUFACTURING COMPANY JP 5,982
HUAWEI TECHNOLOGIES COMPANY CN 4,641
INTEL CORPORATION US 3,863
TEXAS INSTRUMENTS US 3,409
MURATA MANUFACTURING COMPANY 2,874
SK HYNIX KR 2,644
SKYWORKS SOLUTIONS US 2,545
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437