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DIFF Subgroup
H04N 25/40

Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled

Introduced: January 2023

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled

Of 4 combined children, 3 exist in both systems.

1 codes are CPC-only extensions.

IPC defines codes here since 2023.

Child Classifications

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  • H04N 25/41 CPC only CPC only
  • H04N 25/42 by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode since 2023 IPC+CPC Available in IPC and CPC
  • H04N 25/46 by combining or binning pixels since 2023 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327

Top Applicants (CPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498