DIFF Main Group
H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof
Introduced: January 2023
IPC and CPC are identically structured here. All 9 subcodes exist in both systems.
IPC defines codes here since 2023.
Child Classifications
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- H04N 25/10 for transforming different wavelengths into image signals since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/20 for transforming only infrared radiation into image signals since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/40 Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled since 2023 +1 CPC IPC+CPC Available in IPC and CPC
- H04N 25/47 Image sensors with pixel address output; Event-driven image sensors; Selection of pixels to be read out based on image data since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/48 Increasing resolution by shifting the sensor relative to the scene since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/60 Noise processing, e.g. detecting, correcting, reducing or removing noise since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/70 SSIS architectures; Circuits associated therewith since 2023 IPC+CPC Available in IPC and CPC