DIFF Subgroup
H04N 25/441 by reading contiguous pixels from selected rows or columns of the array, e.g. interlaced scanning
Introduced: January 2023
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled > by partially reading an SSIS array > by reading contiguous pixels from selected rows or columns of the array, e.g. interlaced scanning
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327
Top Applicants (CPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498