Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Structural association of microphone with electric circuitry therefor

CPC: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00)

Full Title

Full titles differ between systems:

IPC:

Details of transducers > Casings; Cabinets; Mountings therein > Structural association of microphone with electric circuitry therefor

CPC:

Details of transducers, > Casings; Cabinets Mountings therein (H04R1/28 takes precedence ) > Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00)

Additional Content IPC

Structural association of microphone with electric circuitry therefor in electric hearing aids

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

QUALCOMM US 97,396
HUAWEI TECHNOLOGIES COMPANY CN 96,502
SAMSUNG ELECTRONICS COMPANY KR 86,981
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
HUAWEI TECHNOLOGIES COMPANY 55,349
LG ELECTRONICS KR 53,649
CANON 33,341
SONY CORPORATION JP 32,761
ZTE CORPORATION CN 32,274
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327

Top Applicants (CPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

HUAWEI TECHNOLOGIES COMPANY CN 101,476
QUALCOMM US 101,139
SAMSUNG ELECTRONICS COMPANY KR 96,655
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
LG ELECTRONICS KR 55,253
HUAWEI TECHNOLOGIES COMPANY 54,181
SONY CORPORATION JP 35,309
ZTE CORPORATION CN 32,950
INTEL CORPORATION US 27,533
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498