DIFF Subgroup Additional Only
H04R 2207/021 Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
Full Title
Details of diaphragms or cones for electromechanical transducers or their suspension covered by H04R7/00 but not provided for in H04R7/00 or in H04R2307/00 > Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
Top Applicants
Top Applicants (IPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327
Top Applicants (CPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498