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DIFF Subgroup
H04R 7/24

Tensioning by means acting directly on free portions of diaphragm or cone

Introduced: September 1968

Title

Titles differ between systems:

IPC: Tensioning by means acting directly on free portion of diaphragm or cone

CPC: Tensioning by means acting directly on free portions of diaphragm or cone

Full Title

Full titles differ between systems:

IPC:

Diaphragms for electromechanical transducers; Cones > Mounting or tensioning of diaphragms or cones > Tensioning by means acting directly on free portion of diaphragm or cone

CPC:

Diaphragms for electromechanical transducers (in general F16J3/00); Cones (for musical instruments G10 ) > Mounting or tensioning of diaphragms or cones > Tensioning by means acting directly on free portions of diaphragm or cone

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327

Top Applicants (CPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498